NVIDIA’s Hyperscale and HPC Computing unit is responsible for the company’s concerns in enhancing demanding applications from “weather forecasting and energy exploration to computational fluid dynamics and life sciences” with its AI. According to the group’s vice president Ian Buck, it will be doing so with SK Hynix’ take on HBM3E (or extended HBM3) going forward.
The new iteration upgrade on the “highest-specification DRAM for AI applications currently available” has turned out capable of processing data “up to 1.15 terabytes” (TB, or 230+ FHD videos of 5GB in size each) a second, according to SK Hynix. It also comes with a “10%” upgrade in terms of “heat dissipation” (although compared to what is not given) thanks to the latest Mass Reflow Molded Underfill (MR-MUF) process technology.
SK Hynix’ HBM3E is also rated for backward compatibility, so that it can act as a direct RAM upgrade in a system with CPUs and GPUs that might heretofore have been set up to use HBM3. The company projects that it can start mass production from the 1st half of 2024 (1H2024), although its sampling process to customers like NVIDIA is currently underway.
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I became a professional writer and editor shortly after graduation. My degrees are in biomedical sciences; however, they led to some experience in the biotech area, which convinced me of its potential to revolutionize our health, environment and lives in general. This developed into an all-consuming interest in more aspects of tech over time: I can never write enough on the latest electronics, gadgets and innovations. My other interests include imaging, astronomy, and streaming all the things. Oh, and coffee.
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