SK Hynix has introduced a groundbreaking advancement in dynamic random-access memory (DRAM) technology, unveiling the ‘HBM3E’ memory, a cutting-edge product tailored explicitly for artificial intelligence (AI) applications. The newly unveiled HBM3E memory boasts an astonishing data processing rate of 1.15 terabytes per second, which translates to 230 full high-definition (FHD) movies, each possessing a size of 5 gigabytes.
“As the exclusive manufacturer of HBM3, our development of the world’s most superior HBM3E showcases our deep expertise and commitment to leading the AI memory market,” the brand commented in a press release.
The new DRAM chip also provides enhanced heat dissipation by 10% compared to its predecessor and has backward compatibility for integration into existing systems.
Image Credit: SK Hynix
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